Dynamic News
WAFER IPA SPRAY BAR advantages
发布于2019-02-27 15:09 文章来源：未知
①HOLE TYPE modification , increase number of holes
Increase amount of IPA, firmly proceed DRY process
After CMP, eliminate particles & residue on WAFER
improve elimination Particles (Defect reduced as 20~30%)
②Improve production via Time saving on DRY process
S社, H社 : Dryer Time 25sec ~ 35sec
Cleaning per hour Wafer Output as 85~90wafers : Improve 30% UP
It will be proven via demonstration
③COST DOWN
Local manufacturing : Cost 20~30% Down
③COST DOWN
Local manufacturing : Cost 20~30% Down
Easy to substitution
④Quality assurance
prolong parts replacement by clogging HOLEs : extend life time (2 or 3 years)
easy to find root cause on malfunction
